THINKPAD X1 CARBON GEN 12PROCESSOR: INTEL CORE ULTRA 7 155H, 16C (6P + 8E + 2LPE) / 22T, MAX TURBO UP TO 4.8GHZ, 24MBAI PC CATEGORY: AI PCNPU: INTEL AI BOOST, UP TO 11 TOPSGRAPHICS: INTEGRATED INTEL ARC GRAPHICSCHIPSET: INTEL SOC PLATFORMMEMORY:32GB SOLDERED LPDDR5X
6400MEMORY SLOTS: MEMORY SOLDERED TO SYSTEMBOARD, NO SLOTS, 8
CHANNELMAX MEMORY: 32GB SOLDERED MEMORY, NOT UPGRADABLESTORAGE: 1TB SSD M.2 2280 PCIE 4.0X4 NVME OPAL 2.0STORAGE SUPPORT: ONE DRIVE, UP TO 2TB M.2 2280 SSDSTORAGE SLOT: ONE M.2 2280 PCIE® 4.0 X4 SLOTBATTERY: INTEGRATED 57WHPOWER ADAPTER: 65W USB
C (2
PIN)DISPLAY:14 WUXGA (1920X1200) IPS 400NITS ANTI
GLARE, 100% SRGB, 60HZ, LOW POWERKEYBOARD: BACKLIT, SPANISH (LA)CASE COLOR: BLACK, PAINTCASE MATERIAL: CARBON FIBER (TOP), ALUMINIUM (BOTTOM)DIMENSIONS (WXDXH): 312.80 X 214.75 X 14.96 MM (12.31 X 8.45 X 0.59 INCHES)OPERATING SYSTEM: WINDOWS 11 PRO, SPANISHBUNDLED SOFTWARE: INTEL CONNECTIVITY PERFORMANCE SUITEETHERNET: NO ONBOARD ETHERNETWLAN + BLUETOOTH: INTEL WI
FI 7 BE200, 802.11BE 2X2 + BT5.3STANDARD PORTS:1X USB
A (USB 5GBPS / USB 3.2 GEN 1)1X USB
A (USB 5GBPS / USB 3.2 GEN 1), ALWAYS ON2X USB
C® (THUNDERBOLT 4 / USB4® 40GBPS), WITH USB PD 3.0 AND DISPLAYPORT 2.11X HDMI® 2.1, UP TO 4K/60HZ1X HEADPHONE / MICROPHONE COMBO JACK (3.5MM)SECURITY CHIP: DISCRETE TPM 2.0 ENABLEDFINGERPRINT READER: TOUCH STYLE, MATCH
ON
CHIP, IN KEYBOARD KEYPHYSICAL LOCKS: KENSINGTON NANO SECURITY SLOT, 2.5 X 6 MMBASE WARRANTY: 1
YEAR, COURIER OR CARRY
ININCLUDED UPGRADE: 3Y PREMIER SUPPORT UPGRADE FROM 1Y COURIER/CARRY
IN